Mechanical Simulation of 2G HTS Tapes and Stacks During Localized Temperature Increase

IF 1.7 3区 物理与天体物理 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Hamed Milanchian;Shahriar Bakrani Balani;Tiina Salmi
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引用次数: 0

Abstract

High-temperature superconductor (HTS) materials have emerged as promising candidates for high-field magnets due to their superior critical current density, temperature, and magnetic fields. During magnet quench, high current density can quickly lead to local temperature increase and temperature gradient that can potentially damage the coil. This paper presents an analysis of the mechanical impact of the large thermal gradients. The study employs 3D finite element method (FEM) simulations to investigate the mechanical responses of second-generation HTS tapes to different hotspot temperature profiles. The focus is on analyzing the axial tape strain, normal stress and the various shear stresses in tape layer interfaces. We consider both single tapes and tape stacks. The normal zone propagation is not simulated, but we examine different end-temperature profiles to identify the critical thermal conditions that may lead to too large strain or stress. The results suggest that induced axial strain can exceed the elastic limit or lead to irreversible critical current reduction. Also, the shear stress computed using the Mohr-Coulomb criterion may reach very high values potentially leading to mixed-mode delamination. Future studies are needed to verify the damage methods after high temperatures and help in determining the maximum safe temperature in magnet design. The results highlight the importance of mechanical boundary conditions in this type of numerical or experimental study.
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来源期刊
IEEE Transactions on Applied Superconductivity
IEEE Transactions on Applied Superconductivity 工程技术-工程:电子与电气
CiteScore
3.50
自引率
33.30%
发文量
650
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Applied Superconductivity (TAS) contains articles on the applications of superconductivity and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Large scale applications include magnets for power applications such as motors and generators, for magnetic resonance, for accelerators, and cable applications such as power transmission.
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