Unveiling Dielectric Interface Charge Dynamics Under Unipolar Repetitive Pulses with the In-Situ Pockels Effect Technique.

IF 8.2 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
ACS Applied Materials & Interfaces Pub Date : 2025-04-30 Epub Date: 2025-03-17 DOI:10.1021/acsami.4c20354
Kaixuan Li, Boya Zhang, Ziyue Yang, Minghan Yao, Yixuan Li, Jie Li, Zachary Zintak, Qingrui Yuchi, Xingwen Li
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引用次数: 0

Abstract

Unipolar repetitive pulse (URP) is one of the factors that jeopardize power electronic devices. Failures induced by URP often occur at the interface between two different dielectrics, and this location's inaccessibility makes detection challenging. In this paper, the Pockels effect is utilized for noninvasive monitoring, for the first time allowing the dynamic evolution of interface charges to be observed during the URP interface discharge process, thereby achieving visualization of power modules packaging interface charges that were previously undetectable. The URP interface discharge is updated to include two stages: propagation and persistence. The former is marked by the simultaneous conclusion of interface charge propagation and pulse current, while the latter indicates the persistent activity of interface charges. Furthermore, the evolution of interface charges over multiple URP cycles is defined into different stages based on distribution characteristics. Ultimately, the interface charge density is used to assess interface insulation damage.

利用原位波克尔效应技术揭示单极重复脉冲下介电界面电荷动力学。
单极重复脉冲(URP)是危害电力电子设备的因素之一。URP引起的故障通常发生在两种不同介质之间的界面,该位置的不可达性给检测带来了挑战。本文利用Pockels效应进行无创监测,首次观察到URP界面放电过程中界面电荷的动态演变,从而实现了以前无法检测到的电源模块封装界面电荷的可视化。URP接口释放被更新为包括两个阶段:传播和持久。前者的特征是界面电荷传播和脉冲电流同时发生,后者的特征是界面电荷的持续活动。在此基础上,根据界面电荷在多个URP循环中的分布特征,将其划分为不同的演化阶段。最后,用界面电荷密度来评估界面绝缘损伤。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
ACS Applied Materials & Interfaces
ACS Applied Materials & Interfaces 工程技术-材料科学:综合
CiteScore
16.00
自引率
6.30%
发文量
4978
审稿时长
1.8 months
期刊介绍: ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.
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