{"title":"Gas tungsten arc welding as a method for producing bulk thermoelectric higher manganese silicide materials","authors":"N. Bouhelal , Y. Mebdoua , M. Benamar , H. Lahmar","doi":"10.1016/j.surfcoat.2025.132058","DOIUrl":null,"url":null,"abstract":"<div><div>In this study, the Gas Tungsten Arc Welding (GTAW) method was utilized to densify mechanically alloyed higher manganese silicide powder. The results demonstrated that this approach successfully produced dense samples with a density of 5.02 g/cm<sup>3</sup>, and importantly, there was no observed oxidation, but high tungsten contamination from the welding rod was detected.</div><div>Additionally, the sintered samples exhibited excellent electrical conductivity values, reaching approximately 750 S/cm, along with a Seebeck coefficient of 90 μV/K and a power factor of 0.58 mW/mk<sup>2</sup> at room temperature. These findings highlight the potential of GTAW as an effective and efficient technique for the fabrication of thermoelectric materials, combining strong material properties with practical applicability in energy conversion technologies.</div></div>","PeriodicalId":22009,"journal":{"name":"Surface & Coatings Technology","volume":"504 ","pages":"Article 132058"},"PeriodicalIF":5.3000,"publicationDate":"2025-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Surface & Coatings Technology","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0257897225003329","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, COATINGS & FILMS","Score":null,"Total":0}
引用次数: 0
Abstract
In this study, the Gas Tungsten Arc Welding (GTAW) method was utilized to densify mechanically alloyed higher manganese silicide powder. The results demonstrated that this approach successfully produced dense samples with a density of 5.02 g/cm3, and importantly, there was no observed oxidation, but high tungsten contamination from the welding rod was detected.
Additionally, the sintered samples exhibited excellent electrical conductivity values, reaching approximately 750 S/cm, along with a Seebeck coefficient of 90 μV/K and a power factor of 0.58 mW/mk2 at room temperature. These findings highlight the potential of GTAW as an effective and efficient technique for the fabrication of thermoelectric materials, combining strong material properties with practical applicability in energy conversion technologies.
期刊介绍:
Surface and Coatings Technology is an international archival journal publishing scientific papers on significant developments in surface and interface engineering to modify and improve the surface properties of materials for protection in demanding contact conditions or aggressive environments, or for enhanced functional performance. Contributions range from original scientific articles concerned with fundamental and applied aspects of research or direct applications of metallic, inorganic, organic and composite coatings, to invited reviews of current technology in specific areas. Papers submitted to this journal are expected to be in line with the following aspects in processes, and properties/performance:
A. Processes: Physical and chemical vapour deposition techniques, thermal and plasma spraying, surface modification by directed energy techniques such as ion, electron and laser beams, thermo-chemical treatment, wet chemical and electrochemical processes such as plating, sol-gel coating, anodization, plasma electrolytic oxidation, etc., but excluding painting.
B. Properties/performance: friction performance, wear resistance (e.g., abrasion, erosion, fretting, etc), corrosion and oxidation resistance, thermal protection, diffusion resistance, hydrophilicity/hydrophobicity, and properties relevant to smart materials behaviour and enhanced multifunctional performance for environmental, energy and medical applications, but excluding device aspects.