Thermoelastic and electromagnetic effects in a semiconducting medium

IF 2.3 3区 工程技术 Q2 MECHANICS
N. Islam, B. Das, G. C. Shit, A. Lahiri
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Abstract

This paper addresses the generalized electromagnetothermoelastic problem for a homogeneous and isotropic thin circular semiconductor. We consider the non-local heat conduction equation due to the miniaturization of modern electronic devices and the prevalent use of ultrashort lasers in environments with extremely high-temperature gradients, along with the presence of a primary electromagnetic field. We assume that while heat propagation exhibits non-local properties, deformation behaves locally. The curved surface of the semiconductor is subjected to an exponentially time-dependent thermal and mechanical load. We employ a finite difference method utilizing the Crank–Nicolson implicit scheme to solve the governing coupled linear equations of hyperbolic type for extremely short-time actions and small microstructured sizes. Our study investigates the impact of the chemical concentration and the physical field variables of the diffusive material to predict the thermoelastic behavior within the nanostructured semiconducting medium. We present numerical computations of the chemical concentration, temperature distribution, chemical potential, deformation, and stress components for fixed values of physical parameters. The results indicate that the non-local parameter significantly smooths out sudden changes in thermal and stress gradients. The phase-lag parameters associated with heat flux and temperature gradient both have finite-speed thermal wave propagation and account for thermal inertia effects. These mechanisms collectively contribute to a reduction in surface resistance. Such factors are essential for precisely capturing ultrashort thermoelastic responses under rapid thermal loading, enabling improved predictions of material behavior in extreme conditions. These findings are crucial for designing and processing nanoelectromechanical systems (NEMS).

半导体介质中的热弹性和电磁效应
本文探讨了均质和各向同性薄圆形半导体的广义电磁-其他弹塑性问题。由于现代电子设备的微型化和超短激光器在温度梯度极高的环境中的普遍使用,以及主电磁场的存在,我们考虑了非局部热传导方程。我们假设热传播具有非局部特性,而形变则具有局部特性。半导体的弯曲表面承受着指数随时间变化的热负荷和机械负荷。我们采用有限差分法,利用 Crank-Nicolson 隐式方案来求解超短时间作用和微结构尺寸较小的双曲型耦合线性方程。我们的研究探讨了扩散材料的化学浓度和物理场变量对预测纳米结构半导体介质内热弹性行为的影响。我们对固定物理参数值下的化学浓度、温度分布、化学势、变形和应力成分进行了数值计算。结果表明,非局部参数能显著平滑热梯度和应力梯度的突然变化。与热通量和温度梯度相关的相位滞后参数都具有微速热波传播特性,并考虑了热惯性效应。这些机制共同促成了表面电阻的降低。这些因素对于精确捕捉快速热加载下的超短热弹性响应至关重要,可改进极端条件下的材料行为预测。这些发现对于设计和加工纳米机电系统(NEMS)至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Acta Mechanica
Acta Mechanica 物理-力学
CiteScore
4.30
自引率
14.80%
发文量
292
审稿时长
6.9 months
期刊介绍: Since 1965, the international journal Acta Mechanica has been among the leading journals in the field of theoretical and applied mechanics. In addition to the classical fields such as elasticity, plasticity, vibrations, rigid body dynamics, hydrodynamics, and gasdynamics, it also gives special attention to recently developed areas such as non-Newtonian fluid dynamics, micro/nano mechanics, smart materials and structures, and issues at the interface of mechanics and materials. The journal further publishes papers in such related fields as rheology, thermodynamics, and electromagnetic interactions with fluids and solids. In addition, articles in applied mathematics dealing with significant mechanics problems are also welcome.
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