Data-driven characterization of plastic deformation and mechanical properties in hot-pressed Ti/Al/Ti laminates

IF 2.5 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Mohamed Sharaf, Nikunj Rachchh, T. Ramachandran, Aman Shankhyan, Vikasdeep Singh Mann, Mohammed El-Meligy
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引用次数: 0

Abstract

This study investigates the prediction and evaluation of mechanical characteristics in hot-pressed Ti/Al/Ti laminates using a Random Forest (RF) machine learning model. The training dataset was generated through numerical simulations, encapsulating the laminates’ complex mechanical behavior under diverse conditions. To optimize model performance, hyperparameter tuning techniques, including Grid Search (GS), Particle Swarm Optimization (PSO), and Genetic Algorithms (GA), were applied. Among these, the GA-tuned RF model exhibited the highest predictive accuracy, achieving R2 values of 0.947 for yield stress, 0.937 for yield strength, and 0.928 for Poisson’s ratio. The superior performance of the GA-tuned model is attributed to its effective feature selection and optimization capabilities, surpassing GS and PSO by identifying the most relevant input features. Relevance score analysis also revealed a balanced contribution of material geometry (e.g., thickness) and pressing parameters for predicting yield stress and ultimate strength, while induced strain played a significant role in predicting Poisson’s ratio. A case study using the GA-RF model further unveiled intricate relationships between input variables and mechanical properties, providing valuable guidance for optimizing hot-pressing parameters to enhance laminate performance.

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来源期刊
Applied Physics A
Applied Physics A 工程技术-材料科学:综合
CiteScore
4.80
自引率
7.40%
发文量
964
审稿时长
38 days
期刊介绍: Applied Physics A publishes experimental and theoretical investigations in applied physics as regular articles, rapid communications, and invited papers. The distinguished 30-member Board of Editors reflects the interdisciplinary approach of the journal and ensures the highest quality of peer review.
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