Rapid fabrication of flexible copper-plated circuit boards on cotton fabrics and conductive threads for textile materials using pencil-drawn technique

Vinit Srivastava , Shivam Dubey , Rahul Vaish , Bharat Singh Rajpurohit
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Abstract

This study presents an approach for fabricating flexible and stable electroplated circuits directly onto fabric and thread. We achieve this through a simple method. Pencil-drawn patterns on cotton fabric are followed by copper electroplating in a copper sulfate solution. This method eliminates the need for complex pre-treatment and lithography techniques, thus enabling rapid and on-site circuit development. This research investigated the influence of different pencil grades, drawing frequency, and plating time on the overall conductivity and flexibility of the fabric-based circuits. The electroplated copper demonstrated exceptional bending and thermal stability, maintaining consistent conductivity over a wide bending range (-180° to 180°), with minimal linear resistance change after extreme twisting. Furthermore, the fabricated circuits functioned effectively as Light Dependent Resistor (LDR) based Plated Circuit Boards (PCB), demonstrating robustness and practical potential. The fabrication of conductive threads has also been explored by electroplating graphite threads. These threads displayed remarkable flexibility, maintaining consistent conductivity (0.5 Ω/cm) even under tight knots. The copper-plated textile exhibited stable resistance: 0.6 Ω across 22 °C to 55 °C and 0.5 Ω/cm under bending angles from -180° to +180°. It endured 1000 folding cycles, with resistance increasing slightly to 1.3 Ω. Furthermore, this work shows that the flexible PCBs are resistant to folding stress, environmentally friendly, and disposable, which is a significant step toward sustainable electronics. The results of this study hold significant potential applications in textile-based electrical systems, wearable electronics, and sensors.

Abstract Image

利用铅笔绘制技术在棉织物上快速制作柔性镀铜电路板和纺织材料导电线
本研究提出了一种直接在织物和螺纹上制造柔性且稳定的电镀电路的方法。我们通过一个简单的方法来实现这一点。用铅笔在棉织物上绘制图案,然后在硫酸铜溶液中电镀铜。这种方法消除了复杂的预处理和光刻技术的需要,从而实现了快速的现场电路开发。本研究考察了不同铅笔牌号、拉伸频率和电镀时间对织物基电路整体导电性和柔韧性的影响。电镀铜表现出优异的弯曲和热稳定性,在很宽的弯曲范围内(-180°至180°)保持一致的导电性,在极端扭转后线性电阻变化最小。此外,制备的电路有效地作为基于光相关电阻(LDR)的镀电路板(PCB),显示出鲁棒性和实用潜力。用电镀石墨线的方法制备导电线也进行了探索。这些螺纹显示出非凡的柔韧性,即使在紧结下也能保持一致的导电性(0.5 Ω/cm)。镀铜纺织品表现出稳定的电阻:在22°C至55°C范围内为0.6 Ω,在弯曲角度从-180°到+180°范围内为0.5 Ω/cm。它承受了1000次折叠循环,阻力略有增加,达到1.3 Ω。此外,这项工作表明,柔性pcb耐折叠应力,环保和一次性,这是迈向可持续电子产品的重要一步。这项研究的结果在基于纺织品的电气系统、可穿戴电子产品和传感器方面具有重要的潜在应用。
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CiteScore
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