Advances and future perspectives in thermoelectric cooling technology

Abstract

Thermoelectric cooling technology has become a research hotspot due to its alignment with the growing demand for environmentally friendly solutions. Compared to traditional cooling methods, thermoelectric coolers (TECs) offer advantages such as compact size, lightweight, simple structure, and lack of vibration. These benefits allow for easy integration with various power devices and enable precise temperature control. However, TECs face challenges including limited temperature control range and low thermoelectric conversion efficiency. This review explores the latest advancements in TECs across material design, structural design, heat dissipation, and application areas to identify potential solutions. The exploration of room-temperature thermoelectric materials with extremely low lattice thermal conductivity, high Seebeck coefficients, and high electrical conductivity is crucial for enhancing TEC performance. Investigating novel TEC structures and reducing thermal resistance between the TEC’s hot side and the heat sink will improve cooling efficiency. Additionally, optimizing system integration designs for TECs can support low-cost, large-scale commercialization. This review outlines the challenges TECs will face in the future and provides possible solutions. Addressing these issues will significantly boost TECs’ competitiveness within the broader cooling technology landscape.