Design of wide stopband high-selectivity filter based on ICL-CS

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Zikai Wu , Guiqiang Guo , Guodong Su , Bin You , Yongmei Pan , Jun Liu
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引用次数: 0

Abstract

This paper presents an inter-digital coupled line structure loaded with composite stubs (ICL-CS) to achieve high selectivity and a broad frequency range. The design uses triple-line coupling to minimize in-band insertion loss and composite stubs to expand the passband and stopband of the bandpass filter (BPF). Compared to traditional triple-line coupling structures, the ICL-CS offers a significantly wider stopband. The cascade response of triple-line coupling and composite branch nodes is analyzed using an extended odd-even mode method, systematically evaluating the frequency response. Based on this structure, a high-performance BPF is proposed with a wide stopband and excellent selectivity. Experimental results show an operating frequency range of 8.3 GHz to 15.2 GHz, an insertion loss of 2.6 dB, a shape factor of 1.22, and an out-of-band rejection of 26 dB across the stopband range of 16.4 GHz to 34 GHz. This filter is highly suitable for three-dimensional heterogeneous wireless communication systems.
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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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