Harikishor Kumar, Abhishek Agarwal, Michel Kalenga Wa Kalenga, Rabindra Prasad, Parshant Kumar, L Aslesha Chilakamarri, Balram Yelamasetti
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引用次数: 0
Abstract
For the busting of heat, generated in electronic packages, relevant materials need to be developed. Metal matrix composites may be considered as an option to tailor the properties of a material (Cu) by incorporating an additional phase (SiC) for fulfilling the requirements of thermal management systems. The composite (Cu/SiC) was manufactured by friction stir processing. For good interfacial strength, the biggest challenge in the fabrication of Cu/SiC composite was to abolish the reaction between Cu and SiC. Being solid in nature, the process (friction stir processing) does not allow temperature to reach the interfacial interaction. Scanning electron microscopy, electron backscattered diffraction, and optical microscopy were used to characterise the composite for microstructural features (particle dispersion, phases present). To confirm the presence of reinforcement, EDS analysis was also performed on the composite. Results indicated the presence of Cu and SiC phases in the stir zone (SZ) with uniform and homogeneous separation of reinforcements. The composite displayed higher hardness, tensile strength, and wear resistance in comparison to unprocessed copper. However, ductility decreased due to high hardness in the composite.
期刊介绍:
Materials (ISSN 1996-1944) is an open access journal of related scientific research and technology development. It publishes reviews, regular research papers (articles) and short communications. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. Therefore, there is no restriction on the length of the papers. The full experimental details must be provided so that the results can be reproduced. Materials provides a forum for publishing papers which advance the in-depth understanding of the relationship between the structure, the properties or the functions of all kinds of materials. Chemical syntheses, chemical structures and mechanical, chemical, electronic, magnetic and optical properties and various applications will be considered.