Xin Wang , Qingsong Zhao , Fanyi Meng , Keping Wang
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引用次数: 0
Abstract
To address the issue of unbalanced output currents in multi-module parallel power applications, this paper proposes a novel parallel current-sharing circuit structure and control strategy, which is suitable for the standard packaging of brick power supplies. This approach eliminates the need for additional controllers and current-sharing circuits and can enhance system stability and reliability. Furthermore, this paper introduces a design method for multi-order RC low-pass filters in series, effectively reducing voltage ripple and improving ADC sampling accuracy. To validate the proposed theory, a simulation model was developed using two 2 kW full-brick power converters. The results demonstrate that the proposed method significantly improves current-sharing accuracy compared to systems without a current-sharing control strategy.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.