Jiaxin Wang, Shixin Xiu, Yuzi Jiang, Minhao An, XingYu Lin
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引用次数: 0
Abstract
Cup-shaped axial magnetic field(AMF) contact generates the AMF through the flow of current in the cup finger to control the arc to maintain the diffusion state. It has been widely used in vacuum interrupters. With the development of the power industry, the vacuum interrupter is required to increase the breaking current further, and the contact gap magnetic field needs to be further optimized. Therefore, the magnetic field and arc characteristics of cup-shaped AMF contacts were investigated from the viewpoint of increasing the slotted rotation angle. It was found that when the slotted rotation angle is increased from 100° to 130°, the maximum AMF strength in the center plane was increased by more than 20 %, and the effective arc utilization area was increased by 13.5 %. Experimental results showed that the peak breaking current increased by more than 10.3 % after increasing the slotted rotation angle. Increased slotted rotation angle improves vacuum interrupter breaking capacity. On the basis of increasing the slot rotation angle, the effects of contact diameter, peak current, and opening time on the vacuum arc characteristics was studied, mainly reflected in the cumulative arc energy, arc development process, and peak arc voltage.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.