Comprehensive analysis of thermal properties and stability in palm fiber-reinforced PLA composites with bran filler for sustainable lightweight materials
Thandavamoorthy Raja , Yuvarajan Devrajan , Saheb Ali , Natrayan L
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引用次数: 0
Abstract
This study investigates the dynamic and thermal stability of palm fiber-reinforced polylactic acid (PLA) composites enhanced with bran filler to develop lightweight and sustainable materials. Composites were prepared with varying bran filler content (5–25 g), while keeping fiber content constant (250 g) and adjusting the PLA matrix accordingly. Mechanical, thermal, and microstructural properties were analyzed. Among the samples, the composite with 15 g bran filler (S3) exhibited the best overall performance. It demonstrated superior fatigue strength (25 MPa at 5000 cycles), enhanced fiber-matrix adhesion, and reduced porosity. Dynamic mechanical analysis confirmed S3's highest storage modulus (2400 MPa at 110 °C) and damping factor (tan δ = 0.340 at 130 °C), indicating excellent viscoelastic properties. Thermal analysis showed improved heat resistance, with the highest heat deflection temperature (134 °C) and lowest thermal conductivity (0.65 W/mK). Thermogravimetric analysis further validated its superior thermal stability, with an onset degradation temperature of 350 °C and the highest residual char (18 %) at 500 °C. These results highlight that moderate bran filler reinforcement optimizes composite performance, while excessive filler can reduce effectiveness. This study presents a novel approach to enhancing PLA composites, making them optimistic for sustainable applications such as automotive components, structural biocomposites, and biodegradable packaging.
期刊介绍:
Case Studies in Thermal Engineering provides a forum for the rapid publication of short, structured Case Studies in Thermal Engineering and related Short Communications. It provides an essential compendium of case studies for researchers and practitioners in the field of thermal engineering and others who are interested in aspects of thermal engineering cases that could affect other engineering processes. The journal not only publishes new and novel case studies, but also provides a forum for the publication of high quality descriptions of classic thermal engineering problems. The scope of the journal includes case studies of thermal engineering problems in components, devices and systems using existing experimental and numerical techniques in the areas of mechanical, aerospace, chemical, medical, thermal management for electronics, heat exchangers, regeneration, solar thermal energy, thermal storage, building energy conservation, and power generation. Case studies of thermal problems in other areas will also be considered.