Rittik Ghosh, Alexandros Provias, Alexander Karl, Christoph Wilhelmer, Theresia Knobloch, Mohammad Rasool Davoudi, Seyed Mehdi Sattari-Esfahlan, Dominic Waldhör, Tibor Grasser
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引用次数: 0
Abstract
Threshold voltage hysteresis in two-dimensional transistor transfer characteristics poses a bottleneck in achieving stable 2D CMOS integrated circuits. Hysteresis is primarily attributed to traps at the channel/oxide interface as well as in the oxide. In this study, we present a physics-based self-consistent modeling framework to investigate the impact of border and interface traps on and apply it to monolayer (1-L) MoS2 field-effect transistors (FETs). The transient trapping and detrapping of charges during gate voltage sweeps across a wide range of frequencies and temperatures is analyzed using a two-state non-radiative multi-phonon (NMP) model. Our results reveal distinct dynamic responses for slow border and fast interface traps, with border traps exhibiting slower time constants due to larger relaxation energies and interface traps showing fast nuclear tunneling-dominated dynamics resulting from the smaller relaxation energies. These simulations highlights the critical role of the spatial and energetic distributions of the traps in determining , providing insights into the stability of 2D FETs and paving the way for improved device engineering.
期刊介绍:
Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.