High Temperature Induced Brittle-Ductile Transition of Monocrystalline Silicon via In Situ Indentation

IF 2.9 3区工程技术 Q2 ENGINEERING, CHEMICAL

Tribology Letters Pub Date : 2025-03-12 DOI:10.1007/s11249-025-01974-5

Zerui Zhao, Xianke Li, Xinhang Yang, Hao Wu, Chi Zhang, Shunbo Wang, Hongwei Zhao

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Abstract

Monocrystalline silicon is difficult to molding process due to the unknown mechanism of temperature-influenced brittle-plastic transition. Indentation test of monocrystalline silicon from room temperature (RT) to 500 °C was carried out within scanning electron microscope (SEM). Evolution of surface damage mode at elevated temperatures was in situ observed. Cracking and extrusion occurred during indentation of monocrystalline silicon from RT to 200 °C, while shallow scallop-shell lateral peeling was found to be generated by a combination of secondary radial crack and shallow lateral crack. The phenomenon of surface peeling disappeared at 300 °C. The plasticity of the material significantly increased. Dislocation motion coexists but competes with microcrack nucleation-expansion with temperature increasing. The completion of the brittle-plastic transition is evident at 500 °C. Cracks are no longer generated on the surface and pile-up phenomenon is enhanced. This discovery demonstrates the feasibility of plastic molding processing of monocrystalline silicon at high temperatures.

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来源期刊

Tribology Letters 工程技术-工程：化工

CiteScore

5.30

自引率

9.40%

发文量

116

审稿时长

2.5 months

期刊介绍： Tribology Letters is devoted to the development of the science of tribology and its applications, particularly focusing on publishing high-quality papers at the forefront of tribological science and that address the fundamentals of friction, lubrication, wear, or adhesion. The journal facilitates communication and exchange of seminal ideas among thousands of practitioners who are engaged worldwide in the pursuit of tribology-based science and technology.