Hybrid additive manufacturing of flexible copper radiofrequency electronics

Abstract

Printable metallic conductors, coupled with robust mechanical and thermal stability, exhibit potential for additive manufacturing in radiofrequency electronics. However, their electrical conductivity is indispensable for realizing their potential in microwave communication, particularly considering the essential aspect of miniaturization in microwave applications. Herein we report printed molecular decomposed copper for manufacturing flexible conductors exhibiting an electric conductivity of 47 MS/m nearly 81 % that of bulk copper, for the use in radiofrequency communications and electromagnetic shielding (68 dB). The demonstrated ultra-thin copper can be laser ablated and transferred to a variety of substrate materials (paper, Kapton®, polyethylene terephthalate, ceramics, and glass). Additive manufacturing techniques used herein demonstrate the potential for scalable manufacturing of flexible hybrid radiofrequency electronics.