Hai-Xu Liu, Yong-Hong Zhang, Xiao-Dong Gong, Jia-Wei Liu
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引用次数: 0
Abstract
A high efficiency three-way power combiner used in solid state power amplifier (SSPA) is proposed in this letter. The power combiner is a six ports circuit composing of cover plate, PCB and base plate, which can achieve three-way signals power combining with broadband and high isolation. Compared with the existing three-way power combiner, branch microstrip lines are adopted instead of isolation resistors between branch lines, and this structure can avoid resistance loss and improve power combining efficiency. From the measured results, less than 4.8 ± 0.2 dB of the three equivalent insertion losses, more than 21 dB of the return loss, and better than 19 dB of isolation from 6.5 to 8 GHz can be achieved. Further processing and testing of back-to-back samples were carried out, and the power combining efficiency of the combiner reached over 94.4%. Based on the combiner, a 200 W solid-state power amplifier was developed with a DC efficiency of 37.5%.
期刊介绍：
Microwave and Optical Technology Letters provides quick publication (3 to 6 month turnaround) of the most recent findings and achievements in high frequency technology, from RF to optical spectrum. The journal publishes original short papers and letters on theoretical, applied, and system results in the following areas.
- RF, Microwave, and Millimeter Waves
- Antennas and Propagation
- Submillimeter-Wave and Infrared Technology
- Optical Engineering
All papers are subject to peer review before publication
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