Engineering a loop thermosyphon with 3D-printed developed microstructured surface of the evaporator

IF 0.5 4区工程技术 Q4 ENGINEERING, AEROSPACE

Thermophysics and Aeromechanics Pub Date : 2025-03-12 DOI:10.1134/S0869864324040085

Yu. V. Lyulin, M. M. Afonin, D. G. Firsov, S. A. Evlashin, A. V. Dedov

引用次数: 0

Abstract

This paper presents the results of development and experiments with a loop thermosyphon with a microstructured heat transfer surface (3D printed) for the case of a flat evaporator and ethanol coolant. The thermal parameters of this device were tested for the temperature in the range from 20 to 128 °C and for the heat flux ranging from 25 to 530 W and for device filling level of 40 ml (100 % of the evaporator volume). It was found that the heat exchanger with pillar-array surface provides the total thermal resistance about 0.18 K/W (corresponding to the top input heat flux equal to 530 W). The developed micropillar array structure for the inner surface of heat exchanger improves the loop thermosyphon efficiency.

查看原文本刊更多论文

求助全文

约1分钟内获得全文求助全文

来源期刊

Thermophysics and Aeromechanics THERMODYNAMICS-MECHANICS

CiteScore

0.90

自引率

40.00%

发文量

审稿时长

>12 weeks

期刊介绍： The journal Thermophysics and Aeromechanics publishes original reports, reviews, and discussions on the following topics: hydrogasdynamics, heat and mass transfer, turbulence, means and methods of aero- and thermophysical experiment, physics of low-temperature plasma, and physical and technical problems of energetics. These topics are the prior fields of investigation at the Institute of Thermophysics and the Institute of Theoretical and Applied Mechanics of the Siberian Branch of the Russian Academy of Sciences (SB RAS), which are the founders of the journal along with SB RAS. This publication promotes an exchange of information between the researchers of Russia and the international scientific community.