Thermal characteristics of a compact cooling system of a powerful LED lighting device based on a spiral heat exchanger and heat pipes

IF 5.1 3区工程技术 Q2 ENERGY & FUELS

Thermal Science and Engineering Progress Pub Date : 2025-03-08 DOI:10.1016/j.tsep.2025.103483

D.V. Pekur , Yu.E. Nikolaenko , S.M. Khairnasov , V.M. Sorokin , D.V. Kozak , R.S. Melnyk , A.M. Minyailo

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引用次数: 0

Abstract

In this paper, a new design of a air-cooling system of a powerful LED lighting device has been developed, which includes the use of eight radially arranged heat pipes to transfer heat from eight COB (Chip-on-Board) matrices to a heat exchange surface made in the form of a spiral heat exchanger. The spiral heat exchanger is cooled by forced air convection and is made of one continuous strip of heat-conducting material, which simplifies its production technology and ensures effective heat removal. Computer simulation made it possible to evaluate the effectiveness of the proposed cooling system for maintaining the temperature of COB matrices within acceptable values. The simulation results show that with a total thermal power of COB matrices of 500 W (62.5 W for each matrix), which is equivalent to an electrical power of about 1000 W, and the use of heat pipes with an effective thermal conductivity of over 2000 W/(m °C), the temperature of COB matrices does not exceed the critical value even with a minimum air flow velocity of 1 m/s and an ambient temperature of + 40 °C. The proposed design of the air cooling system with forced convection effectively ensures heat removal from eight COB matrices, maintaining their operating temperature within acceptable values. This contributes to increased reliability and durability of the LED lighting device while maintaining its compactness. The results obtained indicate the prospects of using spiral exchander and heat pipes with in air-cooling systems for LED devices,with input electrical power of about 1000 W.

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来源期刊

Thermal Science and Engineering Progress Chemical Engineering-Fluid Flow and Transfer Processes

CiteScore

7.20

自引率

10.40%

发文量

327

审稿时长

41 days

期刊介绍： Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.