Guoli Sun , Binhao Qin , Yupeng Zhang , Xinxin Wang , Volodymyr Korzhyk , Oksana Konoreva , Haiyan Wang
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引用次数: 0
Abstract
CoCrFeNiMn high-entropy alloy thin films (HEAFs) were fabricated on TA15 (near-α Ti alloy) and 304 stainless steel (SS) substrates using magnetron sputtering. The films were used as an interlayer in vacuum diffusion welding to enhance the mechanical properties of the welded joints. It was observed that higher sputtering temperatures resulted in increased surface roughness, while significantly enhancing the crystallinity of the crystal structure. During process optimization, it was found that the increase in sputtering temperature had a significant impact on the joint strength. The shear strength of the joint exhibited a trend of initially increasing and then decreasing, with the peak shear strength approximately 76.30 % higher than that of joints without an interlayer. Fracture surface morphology analysis revealed a brittle fracture characteristic. Joints with interlayer exhibited superior mechanical properties compared to those without, owing to the synergistic effect of high entropy and sluggish diffusion, which slowed down element diffusion and effectively suppressed the formation of brittle phases in the weld seam. The results demonstrate that the use of CoCrFeNiMn HEAF as an interlayer significantly enhances the mechanical properties and welding quality of TA15 and 304SS joints, providing a new technical solution for high-strength welding.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.