Effect of post-annealing on RF-sputtered CZTS absorber layer for solar cell application

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Kalyan B. Chavan, Shweta Chaure, Nandu B. Chaure
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引用次数: 0

Abstract

Thin-film solar cells (TFSCs) are important components for solar energy harvesting. CZTS (Cu2ZnSnS4) is composed of earth-abundant environmentally friendly elements with a commendable absorption coefficient and optical energy bandgap. However, poor crystallinity, homogeneity, and low efficiency are common issues associated with CZTS. We address these issues by growing CZTS layers using RF sputtering at a deposition temperature of 300 °C. Rapid Thermal Processing (RTP) was performed for post-deposition treatment at 400 and 500 °C. X-ray diffraction analysis revealed the formation of a tetragonal structure in CZTS. Signature peaks were revealed in the structural analysis. Secondary phases were detected in samples annealed at 500 °C. Upon increasing the RTP temperature, an enhancement in crystallinity was observed. Raman spectroscopy confirms the presence of the secondary phase. The Raman shift associated with the CZTS signature peaks was observed when grown at 300 °C and annealed at 400 and 500 °C. Scanning electron microscopy was used to analyze the surface morphology. The SEM images show that upon increasing the RTP temperature, the grain size increases, and the surface becomes more compact. Cu, Zn, Sn, and S are all present in the deposited thin layers. Variations in the elemental ratios and grading were observed as the deposition and processing temperatures changed.

后退火对太阳能电池用射频溅射CZTS吸收层的影响
薄膜太阳能电池(TFSCs)是太阳能收集的重要部件。CZTS (Cu2ZnSnS4)是由地球上丰富的环保元素组成的,具有良好的吸收系数和光能带隙。然而,结晶度差、均匀性差和效率低是与CZTS相关的常见问题。我们通过在300°C的沉积温度下使用射频溅射生长CZTS层来解决这些问题。在400和500°C下进行快速热处理(RTP)进行沉积后处理。x射线衍射分析表明,在CZTS中形成了一个四边形结构。在结构分析中发现了特征峰。在500°C退火的样品中检测到二次相。当RTP温度升高时,观察到结晶度增强。拉曼光谱证实了次级相的存在。在300℃下生长,400℃和500℃退火时,观察到与CZTS特征峰相关的拉曼位移。采用扫描电镜对其表面形貌进行了分析。SEM图像表明,随着RTP温度的升高,晶粒尺寸增大,表面致密。Cu、Zn、Sn和S均存在于沉积的薄层中。随着沉积温度和加工温度的变化,观察到元素比和级配的变化。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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