Tandem radiative cooling with latent thermal energy storage for enhanced passive cooling and thermal shock resistance

Abstract

Radiative cooling and latent thermal energy storage, requiring no additional energy consumption, are recognized as promising strategies for thermal management. However, the limited theoretical cooling power and strict weather condition requirements of radiative cooling, coupled with the high solar energy absorption of latent thermal energy storage, hinder their practical applications in thermal shock resistance. Here, a tandem passive cooler, combining radiative cooling and latent thermal energy storage, is presented to achieve the dual functionalities of passive cooling and thermal shock resistance. Specifically, the radiative cooling performance of this cooler is enabled by its high solar reflectivity (0.928) and high infrared emissivity (0.947), while its efficient isothermal heat release and absorption ensure temperature stability and high thermal energy storage. Consequently, by overcoming the limitations of both radiative cooling and latent heat thermal energy storage, this tandem passive cooler achieves a maximum temperature reduction of 5.37 °C and an average passive cooling temperature of 3.01 °C, enabling effective radiative cooling. Furthermore, this cooler reduces the maximum temperature of a heated silicon wafer by 27.56 °C compared to radiative cooling alone under thermal shock situations, demonstrating superior thermal shock resistance. Upon cessation of the thermal shock, the solidified latent thermal energy storage materials release their stored energy, mitigating excess heat and preventing overcooling of electronic devices, thereby ensuring the stable operation of electronic systems. This strategy offers a promising path to efficient thermal management under extreme temperature fluctuations, significantly expanding the practical applications of radiative cooling and latent thermal energy storage technologies.