A computational unfolding-based design method for three-dimensional conformal electronic skin with adjustable mounting strain

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Shihang Wang, Jie Jin, Weijie Liu, Zheng Xu, Deqing Mei, Yancheng Wang
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引用次数: 0

Abstract

Three-dimensional (3D) conformal electronic skins (E-skins) have been developed for matching the irregularly surfaces. The 3D conformal E-skins manufactured by direct-curved-surface or dimensional converting methods both need curved-surface calibration. With increase of units’ number and complication of mounting-surface morphology, curved-surface calibration becomes intricate. We report a universal cutting and distributing strategy for E-skins. The E-skin incorporates hierarchical and modular tactile sensors to match curvatures and sizes, thereby reducing mounting strain. This strategy enables curved-surface performance of 3D conformal E-skins to be characterized by flat-surface calibration results. An example is provided: Three-level sensors are utilized and calibrated on flat and curved surfaces. Performance variations reduce as sensor size decreases, and performance changes of level II and III sensing units are small after mounting. Their calibration results on curved surface are replaced by those on flat surface, proving low mounting strain facilitates 3D conformal E-skins to avoid complicated curved-surface calibration.

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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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