Investigation on the in situ interfacial Mode II fracture toughness of the 3D woven composites

IF 8.3 1区材料科学 Q1 MATERIALS SCIENCE, COMPOSITES

Composites Science and Technology Pub Date : 2025-02-24 DOI:10.1016/j.compscitech.2025.111125

Qingsong Zong , Jinzhao Huang , Junfeng Ding , Licheng Guo

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引用次数: 0

Abstract

The interfacial mode II fracture toughness G_IIC is an important parameter that significantly affects the damage evolution of the composite materials under shear load. Traditional interlaminar fracture toughness test methods are no longer suitable for the measurement of interfacial fracture toughness within the 3D woven composites (3DWCs) because these methods cause yarn breakage, which could overestimate the fracture toughness by more than ten times. To this end, this paper proposes a new method to obtain the in situ interfacial G_IIC of the 3DWCs. The stable propagation of the mode II crack along the interface was achieved by the unique specimen design. A highly restored finite element (FE) model of the specimen was established, and the virtual crack closure technique (VCCT) was adopted to calculate the interfacial G_IIC. The rationality of the experiments and the validation of the simulation have been carefully demonstrated. The values of G_IIC obtained from three different off-axis angles are consistent, which proves the effectiveness of the proposed method.

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来源期刊

Composites Science and Technology 工程技术-材料科学：复合

CiteScore

16.20

自引率

9.90%

发文量

611

审稿时长

33 days

期刊介绍： Composites Science and Technology publishes refereed original articles on the fundamental and applied science of engineering composites. The focus of this journal is on polymeric matrix composites with reinforcements/fillers ranging from nano- to macro-scale. CSTE encourages manuscripts reporting unique, innovative contributions to the physics, chemistry, materials science and applied mechanics aspects of advanced composites. Besides traditional fiber reinforced composites, novel composites with significant potential for engineering applications are encouraged.