Electrical Performance and Stability Improvement of In2O3 Thin-Film Transistors Engendered by Oxygen-Free Focused Plasma Treatment

IF 2.1 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Han-Lin Zhao, Sung-Jin Kim
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Abstract

In the last decade, interest in solution-processed transparent oxide semiconductors has been increasing. Specifically, indium oxide (In2O3) films have been researched due to their processability using aqueous solutions without organic additives. However, the film quality of as-deposited layers might be suboptimal, which requires some type of post-deposition treatment. In this work, the effect of the treatment by a focused plasma (FP) under both N2 (FP-N) and N2:H2 (FP-H) gases on In2O3 thin-film transistors (TFTs) is explored. The In2O3 TFTs with optimized device performance were fabricated using a volatile nitrate precursor at an annealing temperature of 250 °C. The FP-N In2O3 devices achieved saturation mobility (µsat) of 3.83 ± 0.14 cm2/Vs, and the threshold voltage was about 3 V. The FP-H devices with a µsat of 2.56 ± 0.15 cm2/Vs, on/off current ratio of 4.3 × 106, exhibited stable electrical characteristics with improved gate bias stress stability and time-dependent environmental stability. These results demonstrate that FP treatment of solution processed In2O3 semiconductors effectively enhances carrier transport performance and improves bias stability.

Graphical Abstract

Han-Lin Zhao et al., Indium oxide semiconductors prepared based on solution-processes have many advantages, such as the ability to be prepared at low temperatures, but the performance of the prepared devices is poor. This work has shown that the performance of the devices can be improved by subjecting the devices to an oxygen-free focused plasma treatment for different gas

无氧聚焦等离子体处理提高In2O3薄膜晶体管的电性能和稳定性
在过去的十年中,对溶液处理透明氧化物半导体的兴趣一直在增加。具体来说,氧化铟(In2O3)薄膜由于其在不含有机添加剂的水溶液中的可加工性而得到了研究。然而,作为沉积层的薄膜质量可能不是最理想的,这需要某种类型的沉积后处理。本文研究了聚焦等离子体(FP)在N2 (FP- n)和N2:H2 (FP- h)两种气体下处理对In2O3薄膜晶体管(TFTs)的影响。采用挥发性硝酸盐前驱体,在250℃的退火温度下制备了具有优化器件性能的In2O3 tft。FP-N In2O3器件的饱和迁移率(µsat)为3.83±0.14 cm2/Vs,阈值电压约为3 V。FP-H器件的µsat为2.56±0.15 cm2/Vs,开/关电流比为4.3 × 106,具有稳定的电特性,具有更好的栅极偏置应力稳定性和随时间变化的环境稳定性。这些结果表明,FP处理能有效地提高溶液加工的In2O3半导体的载流子输运性能,提高偏压稳定性。than lin Zhao等,基于溶液法制备的氧化铟半导体具有许多优点,例如可以在低温下制备,但制备的器件性能较差。这项工作表明,通过对器件进行不同气体的无氧聚焦等离子体处理,可以提高器件的性能
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Electronic Materials Letters
Electronic Materials Letters 工程技术-材料科学:综合
CiteScore
4.70
自引率
20.80%
发文量
52
审稿时长
2.3 months
期刊介绍: Electronic Materials Letters is an official journal of the Korean Institute of Metals and Materials. It is a peer-reviewed international journal publishing print and online version. It covers all disciplines of research and technology in electronic materials. Emphasis is placed on science, engineering and applications of advanced materials, including electronic, magnetic, optical, organic, electrochemical, mechanical, and nanoscale materials. The aspects of synthesis and processing include thin films, nanostructures, self assembly, and bulk, all related to thermodynamics, kinetics and/or modeling.
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