A Switchable-core Wideband Class-F23 VCO with 200.8 dBc/Hz Peak FoMT in 130-nm SiGe

IF 1.9 3区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Journal Pub Date : 2025-02-27 DOI:10.1016/j.mejo.2025.106613

Lianzhen Zhang, Haipeng Fu, Lang Nie, Zhipeng Wang, Hao Shi, Kaixue Ma

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引用次数: 0

Abstract

In this paper, a wide tuning range low phase noise (PN) voltage controlled oscillator (VCO) is proposed which incorporates three switchable Class-F₂₃ VCO cores. In order to solve the problems of output power degradation and divider error due to charge leakage between cores, a multi-core switching control (MCSC) technology is proposed. This technology enables flexible control of multiple cores operation and improves the isolation between cores. To achieve low PN over a wide tuning range, F₂₃ VCO cores based on fourth-order transformer and second harmonic filtering network are designed. The VCO is fabricated in a 130 nm SiGe BiCMOS technology and achieves a measured wide tuning range of 81% from 2.0 to 4.7 GHz. The measured PN at 1-MHz offset is from −124.8 dBc/Hz

\sim

−134.4 dBc/Hz, with a peak FoMT of 200.8 dBc/Hz. The optimum flicker noise corner is around 100kHz, and the core area is 0.51

{mm}^{2}

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来源期刊

Microelectronics Journal 工程技术-工程：电子与电气

CiteScore

4.00

自引率

27.30%

发文量

222

审稿时长

43 days

期刊介绍： Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.