The interfacial reaction process and phase formation mechanism between the nickel-based superalloy and the SiO2 crucible during vacuum induction melting
IF 3.8 2区 材料科学Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Jinhong Zhang , Jun Wang , Haoxue Yang , Liting Liu , Guodong Zhang , Fasong Cheng , Jinshan Li
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引用次数: 0
Abstract
This work investigated the interfacial reactions between Ni-based superalloys and SiO2 crucibles during vacuum induction melting. Through thermodynamic and kinetic analyses of the interfacial reactions, the underlying mechanisms of the interactions at the superalloy/SiO2 interface are elucidated. The interfacial reactions are facilitated by elemental diffusion at the interface. The Al atoms in the alloy preferentially diffuse to the interface, where they react with O atoms diffusing from the crucible to form Al2O3. The initially formed Al2O3 serves as heterogeneous nucleation sites for TiC. Consequently, a continuous and uniform Al2O3 layer, along with a discontinuous TiC layer, formed at the superalloy/SiO2 interface. Transmission electron microscopy (TEM) analysis confirmed the orientation relationship between the TiC and the superalloy matrix as , indicating that the TiC precipitates from the alloy matrix. A simplified two-factor analysis of variance (ANOVA) of the interfacial reaction layer thickness data reveals that within the temperature range slightly above the melting point of the superalloy, the melting time is the primary factor that significantly affects the thickness of the interfacial reaction layer.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.