Jian Zhang , Yong Wang , Yanlong Zhang , Bo Bi , Qiliang Chen , Yimao Cai
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引用次数: 0
Abstract
The spiking convolutional neural network (SCNN) accelerator is well-suited for intelligent edge devices due to its low power consumption. However, there is still room for improvement in its power efficiency, particularly in terms of computation and memory optimization. In this paper, a temporal parallelism method is proposed to enhance power efficiency by minimizing unnecessary data movement. A streaming dataflow mechanism is introduced to pipeline the computations of convolution and pooling layers. Additionally, a configurable decomposition technique is designed to support arbitrary kernel sizes. The proposed accelerator is implemented on a Xilinx ZCU102 FPGA development board with a clock frequency of 200 MHz. Experiment results show that the proposed design consumes only 1.69 W of power while achieving a peak performance of 921.6 GOPS, resulting in a power efficiency of 545 GOPS per watt.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.