Study the coupling relationship between dielectric constant and breakdown strength in PVDF-based dielectric flexible composites

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2025-02-28 DOI:10.1007/s10854-025-14465-z

Xiaoyan Liu, Kang Zhao, Hua Jiao, Fu Guo, Nala Sun

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引用次数: 0

Abstract

The coupling relationship between dielectric constant (ɛ) and breakdown strength (BDS) in poly(vinylidene fluoride) (PVDF)-based dielectric flexible composites was investigated by comparing the effects of one-dimensional (1D) glass fibers with moderate dielectric constants and zero-dimensional (0D) (K,Na)NbO3 (KNN) particles with high dielectric constants. The study aimed to enhance the decoupling degree between ɛ and BDS by optimizing filler composition and morphology. Results showed that glass fibers promoted the α to γ phase transition in PVDF, enhancing both ɛ and BDS over a broad filler content range (0 ~ 6 vol.%). Specifically, ɛ increased by up to 105%, and BDS reached a maximum of 2620 kV/mm. In contrast, KNN particles rapidly increased ɛ but reduced the decoupling degree due to the quick α to β phase transformation and strong interfacial polarization. The study concludes that optimizing filler morphology and dielectric properties is crucial for developing PVDF-based composites with high energy storage density. Future work should explore other fillers and composite structures to further enhance the decoupling effect and develop advanced dielectric materials for high-performance applications.

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.