Parallel synthesis and physical properties of thickness graded LaCoO3

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Bhargav Y. Pathak, Kuman Gagliya, Swati Pachauri, U. S. Joshi
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Abstract

Functional properties of oxide films largely depend upon its thickness. In conventional one-by-one thin film deposition approach, uniform deposition with single thickness is fabricated. Here, we have employed the concepts of combinatorial chemistry in pulsed laser deposition (C-PLD) system for the deposition of LaCoO3 compound. The combinatorial PLD allows one to obtain large variations of thickness onto one substrate in a single experiment. LaCoO3 is chosen to demonstrate the thickness dependent optical properties. Across 9 mm of substrate, more than 30 nm systematic thickness variations were achieved on a 10 mm quartz plate. Controlled mask motion with synchronised laser pulses were introduced to fabricate continuously varying film thickness across the substrate. Structural and surface properties were examined by X-ray diffraction, Raman spectroscopy and AFM respectively. Systematic variations in the electrical resistance and optical band gap were observed with film thickness. Using this unique approach, large number of samples with controlled variation in thickness can be fabricated in single experiment and can be optimized quickly for semiconductors which can be used for tuning the physical properties in RRAMs and solar cells.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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