Conformal Al2O3 coating layer improves electrical insulation of the oriented carbon fibers arrays for highly thermally conductive interface materials

IF 8.3 1区 材料科学 Q1 MATERIALS SCIENCE, COMPOSITES
Min Huang , Ruibang Xie , Zhiqian Wang , Chiyu Wen , Nizao Kong , Chenming Feng , Kaiwen Hou , Zongyun Shao , Fei Han
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Abstract

Mesophase pitch-based carbon fiber is highly sought after in electronic packaging applications due to its excellent thermal conductivity and mechanical properties. However, its poor electrical insulation limits its usage in certain electronic packaging applications. Herein, the carbon fiber is coated with insulating alumina (Al2O3) ceramic to improve the insulation properties of the thermal interface materials. The Al2O3 coating is formed directly onto the surface of carbon fiber using the sol-gel method and subsequent heat treatment, which substantially improves the insulation of the carbon fiber with an increased powder resistivity of nearly 42 times. Subsequently, the thermally conductive carbon fiber fillers are neatly aligned in the silicone rubber matrix along the vertical direction of heat transfer, which results in excellent properties of the prepared thermally conductive pads. The carbon fiber-filled pads exhibit a high thermal conductivity of 14.17 W m−1 K−1, a high resistivity of 1.12 × 1010 Ω cm, a medium breakdown voltage of 2.4 kV mm−1, and a favorable compression ratio (@45 psi) of 54.7 %. This work offers a feasible approach for the development of carbon fiber fillers with integrated thermal conductivity and electrical insulation, leading to the expanded application of carbon fiber in electronic packaging.

Abstract Image

介相沥青基碳纤维具有出色的导热性和机械性能,在电子封装应用中备受青睐。然而,其较差的电绝缘性限制了它在某些电子封装应用中的使用。在这里,碳纤维上涂有绝缘氧化铝(Al2O3)陶瓷,以改善热界面材料的绝缘性能。Al2O3 涂层采用溶胶-凝胶法直接形成于碳纤维表面,随后进行热处理,从而大幅提高了碳纤维的绝缘性能,粉末电阻率提高了近 42 倍。随后,导热碳纤维填料沿着热传导的垂直方向整齐地排列在硅橡胶基体中,从而使制备的导热垫具有优异的性能。碳纤维填充的导热垫具有 14.17 W m-1 K-1 的高热导率、1.12 × 1010 Ω cm 的高电阻率、2.4 kV mm-1 的中等击穿电压和 54.7 % 的良好压缩比(@45 psi)。这项工作为开发具有综合导热性和电绝缘性的碳纤维填料提供了一种可行的方法,从而扩大了碳纤维在电子封装中的应用。
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来源期刊
Composites Science and Technology
Composites Science and Technology 工程技术-材料科学:复合
CiteScore
16.20
自引率
9.90%
发文量
611
审稿时长
33 days
期刊介绍: Composites Science and Technology publishes refereed original articles on the fundamental and applied science of engineering composites. The focus of this journal is on polymeric matrix composites with reinforcements/fillers ranging from nano- to macro-scale. CSTE encourages manuscripts reporting unique, innovative contributions to the physics, chemistry, materials science and applied mechanics aspects of advanced composites. Besides traditional fiber reinforced composites, novel composites with significant potential for engineering applications are encouraged.
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