A study on full-domain transient temperature reconstruction and backward sensor placement for distributed heat source systems

IF 4.9 2区 工程技术 Q1 ENGINEERING, MECHANICAL
Yuwei Ye , Bing Yu , Qing Ai , Meng Liu , Yong Shuai
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引用次数: 0

Abstract

Online estimation of the full-domain temperature field from sparse local measurements is widely desired in effective analysis of thermal behavior, closed-loop control, and state tracking for heat-source systems. Despite advances in inversion techniques, these methods mainly focus on steady-state conditions and are often application-dependent. Moreover, existing forward sensor placement methods only yield a single sub-optimal combination. For efficient online thermal monitoring based on limited observations, a transient-state reconstruction technique and sensor placement for complex heat-source systems are described. In offline preparation, proper orthogonal decomposition (POD) is employed to identify dominant eigenvectors from representative high-fidelity temperature fields, capturing the distribution and evolutionary patterns of heat-source systems. Subsequently, a novel intelligent method, Improved Coral Reef Optimization (ICRO), which provides a new and reliable option for solving sophisticated optimization problems, and two associated backward sensor placement strategies with objective criterion of cross-validation L2 norm error, are proposed for diverse sensor layouts and high-quality reconstruction. During online phase, coefficients of dominant eigenvector set are dynamically and robustly solved based on least squares estimator and sparse measurements, allowing for real-time inference of global thermal state. Addressing the lack of references regarding performance improvement, the influence of key parameters on reconstruction was firstly investigated with analytical models, and sensor placement optimization strategy was preliminarily validated. Finally, comprehensive evaluations of proposed sensor placement and reconstruction were conducted in two typical cases of complex heat-source systems under various operating conditions: the simulation of multi-chip printed circuit board (PCB) with anisotropic conductivity, and the experimental case of variable heat-source system. These assessments demonstrated the effectiveness and reliability of the sensor placement strategy and online reconstruction.
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来源期刊
International Journal of Thermal Sciences
International Journal of Thermal Sciences 工程技术-工程:机械
CiteScore
8.10
自引率
11.10%
发文量
531
审稿时长
55 days
期刊介绍: The International Journal of Thermal Sciences is a journal devoted to the publication of fundamental studies on the physics of transfer processes in general, with an emphasis on thermal aspects and also applied research on various processes, energy systems and the environment. Articles are published in English and French, and are subject to peer review. The fundamental subjects considered within the scope of the journal are: * Heat and relevant mass transfer at all scales (nano, micro and macro) and in all types of material (heterogeneous, composites, biological,...) and fluid flow * Forced, natural or mixed convection in reactive or non-reactive media * Single or multi–phase fluid flow with or without phase change * Near–and far–field radiative heat transfer * Combined modes of heat transfer in complex systems (for example, plasmas, biological, geological,...) * Multiscale modelling The applied research topics include: * Heat exchangers, heat pipes, cooling processes * Transport phenomena taking place in industrial processes (chemical, food and agricultural, metallurgical, space and aeronautical, automobile industries) * Nano–and micro–technology for energy, space, biosystems and devices * Heat transport analysis in advanced systems * Impact of energy–related processes on environment, and emerging energy systems The study of thermophysical properties of materials and fluids, thermal measurement techniques, inverse methods, and the developments of experimental methods are within the scope of the International Journal of Thermal Sciences which also covers the modelling, and numerical methods applied to thermal transfer.
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