Cavity-stacked filter in CLAF-SIW technology for millimeter waves

IF 3 3区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Cleofás Segura-Gómez , Andrés Biedma-Pérez , David Santiago , Ángel Palomares-Caballero , Iván Arregui , Miguel A. Gómez Laso , Pablo Padilla
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引用次数: 0

Abstract

This work presents the design of a cavity-stacked bandpass filter (BPF) using contactless air-filled substrate integrated waveguide (CLAF-SIW) technology for millimeter-wave frequencies. This technology is a variant of air-filled SIW technology, incorporating contactless techniques. It enables the reduction of dielectric losses in SIW filters while supporting multilayer structures with robust assembly. The cavity-stacked filter topology allows for very good frequency responses with a reduced footprint and no transitions needed. As an example, a 4th-order Chebyshev bandpass filter composed of four stacked cavities, coupled through irises, is shown. The iris layers are fabricated by metallizing the slot edges of a PCB, while the cavity layers are implemented using CLAF-SIW. The filter has been designed and manufactured to provide a passband response from 36 GHz to 37.5 GHz. A good agreement between measurement and simulation has been achieved. The losses in the proposed CLAF-SIW filter are primarily due to the metal roughness of the low-cost commercial laminates used.
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来源期刊
CiteScore
6.90
自引率
18.80%
发文量
292
审稿时长
4.9 months
期刊介绍: AEÜ is an international scientific journal which publishes both original works and invited tutorials. The journal''s scope covers all aspects of theory and design of circuits, systems and devices for electronics, signal processing, and communication, including: signal and system theory, digital signal processing network theory and circuit design information theory, communication theory and techniques, modulation, source and channel coding switching theory and techniques, communication protocols optical communications microwave theory and techniques, radar, sonar antennas, wave propagation AEÜ publishes full papers and letters with very short turn around time but a high standard review process. Review cycles are typically finished within twelve weeks by application of modern electronic communication facilities.
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