Improving Cu-network structure of W@20Cu composites by ultrasonic-assisted particles rearrangement

Abstract

This work reports a simple method to improve the connectivity of Cu-network structure in W@20Cu composites with Cu-coated W powders. W@20Cu composites, featuring an interpenetrating W and Cu network structure, were sintered via an ultrasonic-assisted reorganization process of W@20Cu microcapsules. The rearrangement process of ultrasonic vibration in these microcapsules was investigated through numerical simulation. As-sintered W@20Cu composites after ultrasonic-assisted filling of W@20Cu microcapsules exhibit uniform microstructure with a Cu enrichment ratio 54.5 % lower and hardness uniformity 45 % better than the counterparts without ultrasonic vibration, as well as the high tensile strength of 316 MPa and the compressive strength of 448 MPa. This processing strategy can realize precise control of Cu-network structure without increasing the process complexity, providing useful experiences and references for fabricating high-performance WCu composites.