Efficient cooling capability in microchannel heat sink reinforced with Y-shaped fins: Based on artificial neural network, genetic algorithm, Pareto front, and numerical simulation

IF 6.4 2区 工程技术 Q1 THERMODYNAMICS
Xiang Ma , Ali Basem , Pradeep Kumar Singh , Rebwar Nasir Dara , Ahmad Almadhor , Amira K. Hajri , Raymond Ghandour , Barno Abdullaeva , H. Elhosiny Ali , Samah G. Babiker
{"title":"Efficient cooling capability in microchannel heat sink reinforced with Y-shaped fins: Based on artificial neural network, genetic algorithm, Pareto front, and numerical simulation","authors":"Xiang Ma ,&nbsp;Ali Basem ,&nbsp;Pradeep Kumar Singh ,&nbsp;Rebwar Nasir Dara ,&nbsp;Ahmad Almadhor ,&nbsp;Amira K. Hajri ,&nbsp;Raymond Ghandour ,&nbsp;Barno Abdullaeva ,&nbsp;H. Elhosiny Ali ,&nbsp;Samah G. Babiker","doi":"10.1016/j.csite.2025.105936","DOIUrl":null,"url":null,"abstract":"<div><div>Microchannel heat sinks play a vital role in modern technology due to the increasing demand for efficient thermal management in compact electronic devices. These systems enhance heat dissipation and maintain optimal operating temperatures, yet conventional heat sinks often fail to meet the stringent cooling demands of modern technologies. To address this, a novel microchannel heat sink reinforced with Y-shaped fins was introduced as an advanced cooling solution. Unlike traditional straight fins, Y-shaped fins improve flow distribution, reduce hot spots, and enhance temperature uniformity across the system's surface. Artificial neural network models were developed to evaluate the impact of fin geometry on performance. Key geometric parameters, including fin attack angle, vertical spacing, and horizontal spacing, were used as input variables, while the Nusselt number and pressure drop were selected as performance outputs. The results revealed that the fin attack angle was the most influential parameter affecting the outputs. The applied cost functions demonstrated the high accuracy of the models in predicting system performance. A genetic algorithm was employed for single-objective optimization targeting three criteria: maximizing total efficiency, minimizing pressure drop, and maximizing the Nusselt number. Two optimized designs were proposed. Design 1 (with an attack angle of 60°, vertical spacing of 120 μm, and horizontal spacing of 400 μm) was optimal for maximizing total efficiency and minimizing the pressure drop. This design achieved a 69.26 % increase in the Nusselt number and a 42.9 % improvement in total efficiency compared to the finless design. Design 2 (with an attack angle of 120°, vertical spacing of 175.650 μm, and horizontal spacing of 200 μm) focused on only maximizing heat transfer, resulting in a 109.28 % increase in the Nusselt number and a 27.1 % improvement in total efficiency. A multi-objective optimization process was conducted in response to the need to balance these multiple objectives. The TOPSIS analysis and Pareto fronts for the Nusselt number and pressure drop were generated to provide a comprehensive framework for designing an efficient and practical microchannel heat sink.</div></div>","PeriodicalId":9658,"journal":{"name":"Case Studies in Thermal Engineering","volume":"68 ","pages":"Article 105936"},"PeriodicalIF":6.4000,"publicationDate":"2025-02-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Case Studies in Thermal Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2214157X25001960","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"THERMODYNAMICS","Score":null,"Total":0}
引用次数: 0

Abstract

Microchannel heat sinks play a vital role in modern technology due to the increasing demand for efficient thermal management in compact electronic devices. These systems enhance heat dissipation and maintain optimal operating temperatures, yet conventional heat sinks often fail to meet the stringent cooling demands of modern technologies. To address this, a novel microchannel heat sink reinforced with Y-shaped fins was introduced as an advanced cooling solution. Unlike traditional straight fins, Y-shaped fins improve flow distribution, reduce hot spots, and enhance temperature uniformity across the system's surface. Artificial neural network models were developed to evaluate the impact of fin geometry on performance. Key geometric parameters, including fin attack angle, vertical spacing, and horizontal spacing, were used as input variables, while the Nusselt number and pressure drop were selected as performance outputs. The results revealed that the fin attack angle was the most influential parameter affecting the outputs. The applied cost functions demonstrated the high accuracy of the models in predicting system performance. A genetic algorithm was employed for single-objective optimization targeting three criteria: maximizing total efficiency, minimizing pressure drop, and maximizing the Nusselt number. Two optimized designs were proposed. Design 1 (with an attack angle of 60°, vertical spacing of 120 μm, and horizontal spacing of 400 μm) was optimal for maximizing total efficiency and minimizing the pressure drop. This design achieved a 69.26 % increase in the Nusselt number and a 42.9 % improvement in total efficiency compared to the finless design. Design 2 (with an attack angle of 120°, vertical spacing of 175.650 μm, and horizontal spacing of 200 μm) focused on only maximizing heat transfer, resulting in a 109.28 % increase in the Nusselt number and a 27.1 % improvement in total efficiency. A multi-objective optimization process was conducted in response to the need to balance these multiple objectives. The TOPSIS analysis and Pareto fronts for the Nusselt number and pressure drop were generated to provide a comprehensive framework for designing an efficient and practical microchannel heat sink.
求助全文
约1分钟内获得全文 求助全文
来源期刊
Case Studies in Thermal Engineering
Case Studies in Thermal Engineering Chemical Engineering-Fluid Flow and Transfer Processes
CiteScore
8.60
自引率
11.80%
发文量
812
审稿时长
76 days
期刊介绍: Case Studies in Thermal Engineering provides a forum for the rapid publication of short, structured Case Studies in Thermal Engineering and related Short Communications. It provides an essential compendium of case studies for researchers and practitioners in the field of thermal engineering and others who are interested in aspects of thermal engineering cases that could affect other engineering processes. The journal not only publishes new and novel case studies, but also provides a forum for the publication of high quality descriptions of classic thermal engineering problems. The scope of the journal includes case studies of thermal engineering problems in components, devices and systems using existing experimental and numerical techniques in the areas of mechanical, aerospace, chemical, medical, thermal management for electronics, heat exchangers, regeneration, solar thermal energy, thermal storage, building energy conservation, and power generation. Case studies of thermal problems in other areas will also be considered.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信