The thermal reliability of indium-doped low solver SAC/Cu joints and the corresponding alloys

IF 23.2 2区材料科学 Q1 MATERIALS SCIENCE, COMPOSITES

Advanced Composites and Hybrid Materials Pub Date : 2025-02-26 DOI:10.1007/s42114-025-01236-x

Jiaqi Yan, Shanshan Cai, Ming Yuan, Xiaojing Wang, Chen Liu, Jiajun Wang, Ning Liu, Yanlai Wang, Xiaohong Yuan, Hassan Algadi

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引用次数: 0

Abstract

Based on CALPHAD-guided alloy design, key experimental investigations, and first-principles calculations, this study explores the melting characteristics, microstructure, mechanical properties, and fracture mechanisms of Sn-0.5Ag-0.7Cu-3Bi-xIn (x = 4, 8, 12, 17, wt.%)/Cu solder joints. Research reveals that In doping lowers the solidus, liquidus, and peak temperatures, while increasing the melting range and undercooling. The matrix phases of 4In and 8In solders are β-Sn. When the In content exceeds 12 wt.%, the γ-InSn₄ phase starts to appear in the matrix, the matrix is transforming from the original single-phase into a dual-phase matrix. Consistent with it, the interfacial compound phase also has In doped, forming Cu₆(Sn, In)₅. During isothermal aging at 170 °C for 0–750 h, In doped less than 12 wt.% inhibits the growth of Cu₃(In,Sn) and Cu₆(Sn,In)₅, while the joints with just 12 wt.% In doping exhibit the strongest inhibition effect on the interface IMCs. After 750 h of aging, the 12In/Cu solder joint shows the best mechanical properties, with high shear strength and shear energy, minimal displacement damage, and consistent ductile fracture mode before and after aging. The nanoindentation results indicate that the hardness of the IMC layer remains nearly unchanged, and the modulus increases, along with an increase in E_i/H values and plasticity with increasing In content. These results are mainly due to the larger charge density difference between Cu and In atoms compared to those between Cu and Sn atoms, indicating a stronger Cu–In bond compared to the Cu–Sn bond. Because Young’s modulus is an intrinsic property, its magnitude may be related to the strength of bonding in the structure. This study, guided by CALPHAD for phase types and fractions, correlates nanoindentation with changes in mechanical properties and microstructure, and validates material performance through first-principles calculations. It has practical significance for controlling the growth of interface compounds, exploring the impact of the In element doping on solder joint performance, and stabilizing solder joint structures.

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来源期刊

Advanced Composites and Hybrid Materials Multiple-

CiteScore

26.00

自引率

21.40%

发文量

185

期刊介绍： Advanced Composites and Hybrid Materials is a leading international journal that promotes interdisciplinary collaboration among materials scientists, engineers, chemists, biologists, and physicists working on composites, including nanocomposites. Our aim is to facilitate rapid scientific communication in this field. The journal publishes high-quality research on various aspects of composite materials, including materials design, surface and interface science/engineering, manufacturing, structure control, property design, device fabrication, and other applications. We also welcome simulation and modeling studies that are relevant to composites. Additionally, papers focusing on the relationship between fillers and the matrix are of particular interest. Our scope includes polymer, metal, and ceramic matrices, with a special emphasis on reviews and meta-analyses related to materials selection. We cover a wide range of topics, including transport properties, strategies for controlling interfaces and composition distribution, bottom-up assembly of nanocomposites, highly porous and high-density composites, electronic structure design, materials synergisms, and thermoelectric materials. Advanced Composites and Hybrid Materials follows a rigorous single-blind peer-review process to ensure the quality and integrity of the published work.