Effect of dental ceramic coating on thermal, mechanical, and dielectric properties of glass fiber-reinforced wave transparent composite

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Muhammad Qasim, Muhammad Talha Shabbir, Tayyab Hussain, Imran Haider, Muhammad Hassan, Mustafa Anwar
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引用次数: 0

Abstract

Wave transparent composites are crucial in telecommunication systems for protecting against external environmental conditions while ensuring signal transmittance. However, prolonged exposure to harsh environments, particularly UV radiation, moisture, and temperature fluctuations can compromise their durability and performance. This study explores the application of flowable dental ceramic, primarily composed of carbon, silicon, aluminum, oxygen, and potassium, as a protective coating for glass fiber-reinforced epoxy composites to enhance their lifespan. The ceramic-coated substrate, cured at 150 °C, exhibited a 32.34% increase in flexural strength and a 51.85% increase in tensile strength compared to uncoated samples. SEM analysis revealed a uniform distribution, smooth surface, and a well-integrated coating layer. TGA analysis demonstrated that the composite remained thermally stable up to 220 °C, indicating enhanced thermal stability. UV–Vis spectroscopy confirmed that the coating material acts as a barrier, providing effective resistance against UV–Vis degradation. Microwave analysis demonstrated a 23.54% reduction in dielectric constant and an 80% decrease in loss tangent, ensuring maintained radio wave transparency and precise signal transmission. These improvements highlight the ceramic coating's ability to significantly enhance mechanical strength, thermal stability, and signal transmission capabilities, offering a promising solution for extending the durability and performance of wave transparent composites in harsh environments.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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