{"title":"High-Performance Elliptic Curve Scalar Multiplication Architecture Based on Interleaved Mechanism","authors":"Jingqi Zhang;Zhiming Chen;Mingzhi Ma;Rongkun Jiang;An Wang;Weijiang Wang;Hua Dang","doi":"10.1109/TVLSI.2024.3486312","DOIUrl":null,"url":null,"abstract":"High-performance (HP) elliptic curve scalar multiplication (ECSM) hardware implementations hold significant importance in ensuring communication security in high-capacity and high-concurrence application scenarios. By analyzing the inherent priorities and parallelism in ECSMs, we proposed a novel HP ECSM algorithm and a partially parallel inversion algorithm based on the interleaved mechanism. With two dedicated multipliers and one interleaved multiplier, we introduced a compact hardware scheduling scheme to realize the consumption of four clock cycles within each loop of ECSM. The proposed HP ECSM architecture consists of two Karatsuba-Ofman multipliers (KOMs) and one classical multiplier (CM). The multiplexors and pipeline stages are meticulously designed to optimize the critical path (CP). The proposed architecture is implemented over Virtex-7 field-programmable gate array (FPGA), and the throughput reaches 158.03, 138.23, and 117.50 Mbps over <inline-formula> <tex-math>$\\text {GF}(2^{163})$ </tex-math></inline-formula>, <inline-formula> <tex-math>$\\text {GF}(2^{283})$ </tex-math></inline-formula>, and <inline-formula> <tex-math>$\\text {GF}(2^{571})$ </tex-math></inline-formula> using 8762, 20451, and 41974 slices, respectively. The comparisons with recent existing works demonstrate that the performance and throughput of our design are among the top.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"33 3","pages":"757-770"},"PeriodicalIF":2.8000,"publicationDate":"2024-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10742959/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
High-performance (HP) elliptic curve scalar multiplication (ECSM) hardware implementations hold significant importance in ensuring communication security in high-capacity and high-concurrence application scenarios. By analyzing the inherent priorities and parallelism in ECSMs, we proposed a novel HP ECSM algorithm and a partially parallel inversion algorithm based on the interleaved mechanism. With two dedicated multipliers and one interleaved multiplier, we introduced a compact hardware scheduling scheme to realize the consumption of four clock cycles within each loop of ECSM. The proposed HP ECSM architecture consists of two Karatsuba-Ofman multipliers (KOMs) and one classical multiplier (CM). The multiplexors and pipeline stages are meticulously designed to optimize the critical path (CP). The proposed architecture is implemented over Virtex-7 field-programmable gate array (FPGA), and the throughput reaches 158.03, 138.23, and 117.50 Mbps over $\text {GF}(2^{163})$ , $\text {GF}(2^{283})$ , and $\text {GF}(2^{571})$ using 8762, 20451, and 41974 slices, respectively. The comparisons with recent existing works demonstrate that the performance and throughput of our design are among the top.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.