{"title":"Editorial: Renewed Excellence for 2025–2026","authors":"Mircea R. Stan","doi":"10.1109/TVLSI.2024.3520396","DOIUrl":null,"url":null,"abstract":"I am happy and honored to have been reappointed as Editor in Chief (EiC) for the IEEE Transactions on VLSI Systems (TVLSI) for another two-year term. As I continue my efforts to improve the quality of the journal, I am grateful for the renewed trust placed in me by the three IEEE sponsoring societies (CASS, SSCS and CS) and by the VLSI community at large. Contrary to a feared slowdown due to increased difficulties with scaling, the field of Very Large Scale Integration (VLSI) has actually grown at an increasingly fast rate as it provides the hardware backbone for the insatiable AI applications which are taking over the world. The H100/200 GPUs, which are essential for AI training, are the largest “conventional” integrated circuits (IC) with 80 billion transistors, while the wafer-scale WSE2/3, which can provide significant improvements in AI inference, are absolute behemoths with 4 trillion transistors! Mr. Moore can be proud there in heaven for what our industry is able to deliver!","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"33 3","pages":"603-626"},"PeriodicalIF":2.8000,"publicationDate":"2025-02-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10903548","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10903548/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
I am happy and honored to have been reappointed as Editor in Chief (EiC) for the IEEE Transactions on VLSI Systems (TVLSI) for another two-year term. As I continue my efforts to improve the quality of the journal, I am grateful for the renewed trust placed in me by the three IEEE sponsoring societies (CASS, SSCS and CS) and by the VLSI community at large. Contrary to a feared slowdown due to increased difficulties with scaling, the field of Very Large Scale Integration (VLSI) has actually grown at an increasingly fast rate as it provides the hardware backbone for the insatiable AI applications which are taking over the world. The H100/200 GPUs, which are essential for AI training, are the largest “conventional” integrated circuits (IC) with 80 billion transistors, while the wafer-scale WSE2/3, which can provide significant improvements in AI inference, are absolute behemoths with 4 trillion transistors! Mr. Moore can be proud there in heaven for what our industry is able to deliver!
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.