{"title":"Advances in electrolytic copper foils: fabrication, microstructure, and mechanical properties","authors":"Long-Long Lu, Hai-Tao Liu, Zhao-Dong Wang, Qiong-Qiong Lu, Yan-Jun Zhou, Fei Zhou, Yan-Min Zhang, Wei-Wei Lu, Bin Yang, Qian-Qian Zhu, Ke-Xing Song","doi":"10.1007/s12598-024-02965-6","DOIUrl":null,"url":null,"abstract":"<div><p>Electrolytic copper foil has gained significant attention as an essential component in lithium-ion batteries (LIBs), printed circuit boards (PCBs), and chip packaging substrates (CPSs) applications. With the advancement of LIBs towards higher energy densities and the increasing density of electronic components on circuits, copper foil is required to have demanding properties, such as extremely thin thickness and extremely high tensile strength. This comprehensive review firstly summarizes recent progress on the fabrication of electrolytic copper foil, and the effects of process parameters, cathode substrate, and additives on the electrodeposition behavior, microstructure, and properties of copper foil are discussed in detail. Then the regulation strategies of mechanical properties of electrolytic copper foil are also summarized, including the formation of nanotwins and texture. Furthermore, the recent advances in novel electrolytic copper foils, such as composite foils and extra-thin copper foils, are also overviewed. Lastly, the remaining challenges and perspectives on the further development of electrolytic copper foils are presented.</p><h3>Graphical abstract</h3>\n<div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":749,"journal":{"name":"Rare Metals","volume":"44 2","pages":"757 - 792"},"PeriodicalIF":9.6000,"publicationDate":"2024-10-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Rare Metals","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s12598-024-02965-6","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Electrolytic copper foil has gained significant attention as an essential component in lithium-ion batteries (LIBs), printed circuit boards (PCBs), and chip packaging substrates (CPSs) applications. With the advancement of LIBs towards higher energy densities and the increasing density of electronic components on circuits, copper foil is required to have demanding properties, such as extremely thin thickness and extremely high tensile strength. This comprehensive review firstly summarizes recent progress on the fabrication of electrolytic copper foil, and the effects of process parameters, cathode substrate, and additives on the electrodeposition behavior, microstructure, and properties of copper foil are discussed in detail. Then the regulation strategies of mechanical properties of electrolytic copper foil are also summarized, including the formation of nanotwins and texture. Furthermore, the recent advances in novel electrolytic copper foils, such as composite foils and extra-thin copper foils, are also overviewed. Lastly, the remaining challenges and perspectives on the further development of electrolytic copper foils are presented.
期刊介绍:
Rare Metals is a monthly peer-reviewed journal published by the Nonferrous Metals Society of China. It serves as a platform for engineers and scientists to communicate and disseminate original research articles in the field of rare metals. The journal focuses on a wide range of topics including metallurgy, processing, and determination of rare metals. Additionally, it showcases the application of rare metals in advanced materials such as superconductors, semiconductors, composites, and ceramics.