Integration of NiWO4 nanoparticles with multi-walled carbon nanotubes for next-generation energy storage

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2025-02-22 DOI:10.1007/s10854-025-14437-3

R. Suganesh, G. Venkatesh, K. M. Prabu, G. Periyasami, M. Priyadharshini, R. Ranjith, K. L. Meghanathan

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引用次数: 0

Abstract

The demand for supercapacitors with high energy and power densities has accelerated the search for efficient electrode materials. In this study, we prepared a binary composite of multi-walled carbon nanotubes (MWCNT) and nickel tungstate (NiWO₄) using a simple hydrothermal method, achieving a specific capacitance of 885 F g⁻¹ at 1 A g⁻¹ with strong cyclic stability, maintaining 86% capacity after 5000 cycles. Electrochemical analysis revealed a shift in the charge storage mechanism of MWCNT/NiWO₄ composite with “b-values” of 0.84 to low indicating a capacitive-dominant behavior with increased scan rate likely due to the formation of a double-layer and the presence of MWCNTs. The composite exhibited enhanced conductivity with a charge transfer resistance (R_ct) of 0.9 Ω compared to 3.2 Ω for NiWO₄ alone. This study highlights the potential of MWCNT/NiWO₄ as a cost-effective, high-performance electrode material for next-generation supercapacitors.

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.