Significant enhancement of the overall performance of SAC joints by adding Cu@Sn@Ag core shell particles and ultrasonically assisted soldering

IF 4.8 2区材料科学 Q1 MATERIALS SCIENCE, CHARACTERIZATION & TESTING

Materials Characterization Pub Date : 2025-02-18 DOI:10.1016/j.matchar.2025.114858

Jinghui Fan , Minming Zou , Sifan Tan , Guangyu Zhu , Langfeng Zhu , Baowen Fu , Chao Qiang , Zhixiang Wu , Wenjing Chen , Xiaowu Hu , Tao Xu , Xiongxin Jiang

{"title":"Significant enhancement of the overall performance of SAC joints by adding Cu@Sn@Ag core shell particles and ultrasonically assisted soldering","authors":"Jinghui Fan , Minming Zou , Sifan Tan , Guangyu Zhu , Langfeng Zhu , Baowen Fu , Chao Qiang , Zhixiang Wu , Wenjing Chen , Xiaowu Hu , Tao Xu , Xiongxin Jiang","doi":"10.1016/j.matchar.2025.114858","DOIUrl":null,"url":null,"abstract":"<div><div>This paper investigates the effects of Cu@Sn@Ag (CSA) core shell particles and ultrasonic treatment on the microstructures and mechanical properties of Sn-3.0Ag-0.5Cu (SAC305) solder joints. The results indicated the optimum content of CSA particles was 0.05 wt%, and the optimum ultrasonic treatment time for the composite solder with CSA particles was 5 s. The study found that the ultrasonic treatment resulted in the dispersion of the agglomerated CSA particles, a reduction in the number of pores in the solder and a significant improvement in the shear strength of the solder joints. But too much ultrasound time increased IMC thickness and decreased the shear strength of solder joints. Both CSA particles and ultrasonication caused the solder joint to change from a brittle-tough hybrid fracture mode to a ductile fracture mode. A 30.58 % increase in shear strength was observed in solder joints with CSA particles added and ultrasound treated, compared to the original joints. Furthermore, the EBSD results showed that solder containing CSA particles had more nucleation sites, resulting in a finer grain size of the composite solder. The ageing experiment showed that after 360 h of ageing, the grain size of the solder joints containing CSA particles was 15.34 % smaller than the original joints.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"222 ","pages":"Article 114858"},"PeriodicalIF":4.8000,"publicationDate":"2025-02-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Characterization","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1044580325001470","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}

引用次数: 0

Abstract

This paper investigates the effects of Cu@Sn@Ag (CSA) core shell particles and ultrasonic treatment on the microstructures and mechanical properties of Sn-3.0Ag-0.5Cu (SAC305) solder joints. The results indicated the optimum content of CSA particles was 0.05 wt%, and the optimum ultrasonic treatment time for the composite solder with CSA particles was 5 s. The study found that the ultrasonic treatment resulted in the dispersion of the agglomerated CSA particles, a reduction in the number of pores in the solder and a significant improvement in the shear strength of the solder joints. But too much ultrasound time increased IMC thickness and decreased the shear strength of solder joints. Both CSA particles and ultrasonication caused the solder joint to change from a brittle-tough hybrid fracture mode to a ductile fracture mode. A 30.58 % increase in shear strength was observed in solder joints with CSA particles added and ultrasound treated, compared to the original joints. Furthermore, the EBSD results showed that solder containing CSA particles had more nucleation sites, resulting in a finer grain size of the composite solder. The ageing experiment showed that after 360 h of ageing, the grain size of the solder joints containing CSA particles was 15.34 % smaller than the original joints.

查看原文本刊更多论文

求助全文

约1分钟内获得全文求助全文

来源期刊

Materials Characterization 工程技术-材料科学：表征与测试

CiteScore

7.60

自引率

8.50%

发文量

746

审稿时长

36 days

期刊介绍： Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials. The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal. The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include: Metals & Alloys Ceramics Nanomaterials Biomedical materials Optical materials Composites Natural Materials.