High-temperature pre-aging induced coherent precipitation for Concurrent strength and conductivity enhancement in Cu-Mn-Co-P alloys

IF 6.1 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Chengzhi Zhang , Rui Zhou , Xue Xiao , Yuhan Wang , Weilin Gao , Qingkui Li , Jilin He
{"title":"High-temperature pre-aging induced coherent precipitation for Concurrent strength and conductivity enhancement in Cu-Mn-Co-P alloys","authors":"Chengzhi Zhang ,&nbsp;Rui Zhou ,&nbsp;Xue Xiao ,&nbsp;Yuhan Wang ,&nbsp;Weilin Gao ,&nbsp;Qingkui Li ,&nbsp;Jilin He","doi":"10.1016/j.msea.2025.148098","DOIUrl":null,"url":null,"abstract":"<div><div>High-performance copper alloys are critical materials for next-generation electronic applications. This study investigates the effect of high-temperature pre-aging on the microstructure and properties of Cu-0.33Mn-0.31Co-0.17P (wt.%) alloy. Pre-aging promotes the formation of Guinier-Preston (GP) zones and nanoscale (Mn,Co)<sub>2</sub>P precipitates, reducing subsequent aging temperature and enhancing precipitation kinetics. Compared to the conventional SCA process (950 °C for 30 min, cold-rolled, and aged at 500 °C for 4 h), the SPACA process (950 °C for 30 min, pre-aged at 650 °C for 10 min, cold-rolled, and aged at 360 °C for 8 h) increases tensile strength by 55 MPa and electrical conductivity by 8.1 % IACS, achieving values of 715 MPa and 70.9 % IACS. This demonstrates the potential of high-temperature pre-aging for achieving a balanced enhancement of mechanical and electrical properties in copper alloys.</div></div>","PeriodicalId":385,"journal":{"name":"Materials Science and Engineering: A","volume":"928 ","pages":"Article 148098"},"PeriodicalIF":6.1000,"publicationDate":"2025-02-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science and Engineering: A","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0921509325003168","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
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Abstract

High-performance copper alloys are critical materials for next-generation electronic applications. This study investigates the effect of high-temperature pre-aging on the microstructure and properties of Cu-0.33Mn-0.31Co-0.17P (wt.%) alloy. Pre-aging promotes the formation of Guinier-Preston (GP) zones and nanoscale (Mn,Co)2P precipitates, reducing subsequent aging temperature and enhancing precipitation kinetics. Compared to the conventional SCA process (950 °C for 30 min, cold-rolled, and aged at 500 °C for 4 h), the SPACA process (950 °C for 30 min, pre-aged at 650 °C for 10 min, cold-rolled, and aged at 360 °C for 8 h) increases tensile strength by 55 MPa and electrical conductivity by 8.1 % IACS, achieving values of 715 MPa and 70.9 % IACS. This demonstrates the potential of high-temperature pre-aging for achieving a balanced enhancement of mechanical and electrical properties in copper alloys.
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来源期刊
Materials Science and Engineering: A
Materials Science and Engineering: A 工程技术-材料科学:综合
CiteScore
11.50
自引率
15.60%
发文量
1811
审稿时长
31 days
期刊介绍: Materials Science and Engineering A provides an international medium for the publication of theoretical and experimental studies related to the load-bearing capacity of materials as influenced by their basic properties, processing history, microstructure and operating environment. Appropriate submissions to Materials Science and Engineering A should include scientific and/or engineering factors which affect the microstructure - strength relationships of materials and report the changes to mechanical behavior.
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