A New Differential Composite Probe With Outstanding Advantages of High Sensitivity, Multiple Components, and Low Profile

IF 4.3 2区 综合性期刊 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Lei Wang;Rui-Qi Wang;Hui Xiao;Chengyang Luo
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Abstract

In this article, a new differential composite probe with low-profile and high-sensitivity is developed. The proposed probe includes a U-shaped loop as a main element, a pair of U-shaped loops on the outermost layers and a pair of long U-shaped loops on the inner layers as parasitic elements, and two stripline terminated with two sub-miniature A (SMA) connectors. Traditionally, single-loop probes are used to sense electric- and magnetic-field components simultaneously. Here, two pairs of U-shaped loops are introduced as parasitic elements into a single-loop probe to enhance the amount of received electromagnetic signals. Moreover, these parasitic U-shaped loops on the inner layers of the probe are replaced with parasitic long U-shaped loops, thus significantly improving the detection sensitivity. Unlike the detection loops of traditional probes, which are all located on the inner layers, a pair of parasitic U-shaped loops, and the ground planes are printed together on the outermost layers in the proposed probe to reduce the probe’s profile. Because of this new design, the proposed probe only requires a five-layer printed circuit board (PCB) structure instead of a seven-layer PCB structure. A commercial high-frequency electromagnetic simulation software is used to design and simulate the proposed composite probe. A five-layer PCB structure is used to manufacture a prototype, and a self-developed near-field scanning test system with a standard microstrip line is utilized to characterize and calibrate the probe. As last, the simulation and measurement results are compared to verify the design rationality. The comparison results reveal that the designed differential composite probe has high detection sensitivity, a low profile, and the ability of measure electromagnetic-field components.
一种具有高灵敏度、多组分、低轮廓等突出优点的新型差分复合探针
本文研制了一种新型的低轮廓、高灵敏度的复合差动探头。该探针包括一个u形环作为主元件,一对u形环在最外层,一对长u形环在内层作为寄生元件,以及两个带状线端接两个亚微型a (SMA)连接器。传统上,单回路探头用于同时检测电场和磁场元件。在这里,两对u形环路作为寄生元件被引入到单回路探头中,以增强接收电磁信号的量。并且,将探头内层的寄生u形环替换为长u形寄生环,从而显著提高了探测灵敏度。与传统探针的检测回路都位于内层不同,一对寄生u形回路和地平面一起印刷在探针的最外层,以减少探针的轮廓。由于这种新设计,所提出的探针只需要五层印刷电路板(PCB)结构,而不是七层PCB结构。利用商用高频电磁仿真软件对所提出的复合探头进行了设计和仿真。采用五层PCB结构制作原型,并利用自行开发的带标准微带线的近场扫描测试系统对探头进行表征和校准。最后,将仿真结果与实测结果进行了对比,验证了设计的合理性。对比结果表明,所设计的差分复合探头具有检测灵敏度高、外形小、测量电磁场分量能力强的特点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Sensors Journal
IEEE Sensors Journal 工程技术-工程:电子与电气
CiteScore
7.70
自引率
14.00%
发文量
2058
审稿时长
5.2 months
期刊介绍: The fields of interest of the IEEE Sensors Journal are the theory, design , fabrication, manufacturing and applications of devices for sensing and transducing physical, chemical and biological phenomena, with emphasis on the electronics and physics aspect of sensors and integrated sensors-actuators. IEEE Sensors Journal deals with the following: -Sensor Phenomenology, Modelling, and Evaluation -Sensor Materials, Processing, and Fabrication -Chemical and Gas Sensors -Microfluidics and Biosensors -Optical Sensors -Physical Sensors: Temperature, Mechanical, Magnetic, and others -Acoustic and Ultrasonic Sensors -Sensor Packaging -Sensor Networks -Sensor Applications -Sensor Systems: Signals, Processing, and Interfaces -Actuators and Sensor Power Systems -Sensor Signal Processing for high precision and stability (amplification, filtering, linearization, modulation/demodulation) and under harsh conditions (EMC, radiation, humidity, temperature); energy consumption/harvesting -Sensor Data Processing (soft computing with sensor data, e.g., pattern recognition, machine learning, evolutionary computation; sensor data fusion, processing of wave e.g., electromagnetic and acoustic; and non-wave, e.g., chemical, gravity, particle, thermal, radiative and non-radiative sensor data, detection, estimation and classification based on sensor data) -Sensors in Industrial Practice
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