Effect of flexoelectricity on buckle-delamination of nanofilms adhered to compliant substrates

IF 3.4 3区 工程技术 Q1 MECHANICS
Yihang Chen , Tingjun Wang , Yuanyuan Cui, Yingzhuo Lun, Jiawang Hong
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引用次数: 0

Abstract

Buckle-delamination, a typical instability mode, can spontaneously introduce large, sizable-area and tunable strain gradients in nanofilms adhered to compliant substrates, which helps to exploit the flexoelectric effect. However, the role of flexoelectricity in the buckle-delamination behavior of dielectric nanofilms remains unclear. Here, an electromechanical coupling model is developed to capture the flexoelectric effect in buckle-delaminated films on compliant substrates. The energy analysis indicates that the interplay between flexoelectricity and buckling promotes the delamination process by increasing the width of buckle-delaminated blisters. Moreover, the coupling of flexoelectricity and piezoelectricity breaks the anti-symmetric distribution of in-plane stress, thereby affecting the position and magnitude of the maximum tensile stress. We also investigate the size-dependent effect of flexoelectricity in buckle-delamination behavior and demonstrate its crucial role in films of nanoscale thickness. This work can advance the understanding of the flexoelectric effect in buckle-delamination behavior and pave the way for its practical applications.
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来源期刊
CiteScore
6.70
自引率
8.30%
发文量
405
审稿时长
70 days
期刊介绍: The International Journal of Solids and Structures has as its objective the publication and dissemination of original research in Mechanics of Solids and Structures as a field of Applied Science and Engineering. It fosters thus the exchange of ideas among workers in different parts of the world and also among workers who emphasize different aspects of the foundations and applications of the field. Standing as it does at the cross-roads of Materials Science, Life Sciences, Mathematics, Physics and Engineering Design, the Mechanics of Solids and Structures is experiencing considerable growth as a result of recent technological advances. The Journal, by providing an international medium of communication, is encouraging this growth and is encompassing all aspects of the field from the more classical problems of structural analysis to mechanics of solids continually interacting with other media and including fracture, flow, wave propagation, heat transfer, thermal effects in solids, optimum design methods, model analysis, structural topology and numerical techniques. Interest extends to both inorganic and organic solids and structures.
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