Low Loss Chip-to-Chip Couplers for High-Density Co-Packaged Optics

Abstract

Co-Packaged Optics

In article number 2402095, Drew Weninger, Samuel Serna, and co-workers present a co-packaged optics system with an electrical chip (black, center) surrounded by 8 silicon photonic chips. Chips are bonded using an automated pick-and-place tool, shown placing the final chip into position. The automation is enabled by a novel optical chip-to-chip coupler (green callout).