Hierarchical Cu2O@NiCoMn-OH on copper wire for high-performance flexible supercapacitors

IF 3.8 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Xiaozheng Su , Yaqi Xu , Haoran Shi , Jianhua Yu , Jing Sui , Qian Zhang , Liyan Yu , Lifeng Dong
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引用次数: 0

Abstract

Extensive efforts have been made to develop active materials with high energy density to meet the current demand for high-performance energy storage devices. In this study, we successfully achieved a hierarchical structure combining copper oxide and NiCoMn ternary metal hydroxide through a two-step electrochemical deposition process on the surface of a copper wire (CW) current collector. This unique structure consists of an internal honeycomb-like Cu2O framework and external NiCoMn-OH nanosheets. The resulting electrode exhibits enhanced electrochemical performance due to the synergistic effect between these two active materials, demonstrating a high specific capacitance of 956 F g−1 at a current density of 4 A g−1. Moreover, the as-fabricated symmetric flexible supercapacitor exhibited an impressive specific capacitance of 11.06 F cm−3 at a current density of 0.3 A cm−3, along with an excellent capacitance retention rate of up to 93.26 % after 6000 cycles. Moreover, the device demonstrated a remarkable energy density of 0.18 mWh cm−2 when operated at a power density of 11.77 mW cm−2.

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来源期刊
Vacuum
Vacuum 工程技术-材料科学:综合
CiteScore
6.80
自引率
17.50%
发文量
0
审稿时长
34 days
期刊介绍: Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
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