Numerical investigation of heat transfer enhancement in mini-channels with modified surface protrusions

IF 2.6 3区 工程技术 Q2 ENGINEERING, MECHANICAL
Yuan Wang
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引用次数: 0

Abstract

Numerical simulation is conducted to investigate the heat transfer enhancement characteristics of channel surface modifications. Two-dimensional Inconel 718 mini-channels with modified triangular surface protrusions are used, employing supercritical-pressurized n-decane as the working fluid at an outlet pressure of 3.0 MPa and an inlet mass flow rate of 1 kg/s. A set of 76 test cases are designed to examine the influence of protrusion geometry, distribution, and varying channel surface heat flux ranging from 0.5 MW/m2 to 1.0 MW/m2. Structural temperature, average heat transfer coefficient havg, and friction factor f are calculated. Effects of the protrusion location and geometric parameters are discussed. It is found that protrusion height positively dominates both havg and f, with Pearson’s correlation coefficient r of 0.78085 and 0.78316, respectively. The protrusion leading length x1 has a slightly higher impact on havg compared to the trailing length x2, with rhavg-x1 = 0.35053 and rhavg-x2 = 0.30534. An increase in x2 shows a more profound impact on f compared to x1. Lower inter-convexity distance, increased convexity height and convexity leading length are recommended for heat transfer enhancement. The outcomes of the present study provide valuable insights for optimizing cooling channels in thermal protection systems under high heat flux and supercritical conditions.
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来源期刊
International Journal of Heat and Fluid Flow
International Journal of Heat and Fluid Flow 工程技术-工程:机械
CiteScore
5.00
自引率
7.70%
发文量
131
审稿时长
33 days
期刊介绍: The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.
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