Design and experimental validation of non-trimming polishing plate for high wear-resistant workpieces based on optimized motion trajectory distribution

Abstract

During the polishing of high wear-resistant workpieces, achieving uniform wear on the polishing plate is crucial for enhancing the accuracy of the workpiece and prolonging the service life of the polishing plate. The trajectory of workpiece movement on the polishing plate significantly influences its wear uniformity, especially for workpieces with high hardness and wear-resistance. In this paper, a novel design method for polishing plate tailored for high wear-resistant workpieces was proposed. The structure of the polishing plate was designed to enhance the uniformity of wear, thereby improving the surface accuracy of the workpiece. This method involves establishing kinematic models and calculating polishing trajectories. The relationship between trajectory and wear was analyzed. Consequently, an equal wear polishing plate (EWPP) was designed and manufactured based on the trajectory analysis. Using SiC as the workpiece, a comparative experiment was conducted with a normal polishing plate (NPP) and the newly designed EWPP to verify the effectiveness of the design method. The reasons for the wear of polishing plate and the formation of shape errors in workpieces were discussed. The results demonstrate that wear of polishing plate critically affects the workpiece accuracy, while the shape error of workpiece is effectively suppressed by using EWPP. This innovation improves the machining efficiency of wafer and extends the lifespan of polishing plate, offering a novel approach to improve the processing efficiency and shape accuracy of high wear-resistant workpieces.