Characterizing Six Percolation Cases in Flexible Electronic Composites: A Monte Carlo-Based 3D Compressive Percolation Model for Wearable Pressure Sensors.
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引用次数: 0
Abstract
This study employs a Monte Carlo-based 3D compressive percolation model to systematically analyze the electrical behavior of flexible electronic composites under compressive deformation. By simulating the spatial distribution and connectivity of conductive particles, this study identifies six distinct percolation cases, each describing a unique connectivity evolution under strain. The model reveals that excessive initial connectivity leads to saturation effects, reducing sensitivity, while a high Poisson's ratio (≥0.3) causes connectivity loss due to shear plane expansion. Notably, asymmetric particle shapes, such as cylinders and rectangles, exhibit superior percolation behavior, forming infinite clusters at lower strain thresholds (~0.4) compared to spherical particles (~0.5). Monte Carlo simulations with 3000 particles validate these findings, showing consistent trends in percolation behavior across different deformation states. By classifying and quantifying these six connectivity scenarios, this research provides a structured framework for optimizing flexible sensor designs, ensuring an optimal balance between conductivity and sensitivity. These findings contribute to advancing flexible electronics, particularly in wearable health monitoring, robotics, and smart textiles.
期刊介绍:
Materials (ISSN 1996-1944) is an open access journal of related scientific research and technology development. It publishes reviews, regular research papers (articles) and short communications. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. Therefore, there is no restriction on the length of the papers. The full experimental details must be provided so that the results can be reproduced. Materials provides a forum for publishing papers which advance the in-depth understanding of the relationship between the structure, the properties or the functions of all kinds of materials. Chemical syntheses, chemical structures and mechanical, chemical, electronic, magnetic and optical properties and various applications will be considered.