Numerical Fatigue Analysis of Dissimilar Lap Joints Fabricated by Dimple Spot Welding for Automotive Application.

IF 3.1 3区 材料科学 Q3 CHEMISTRY, PHYSICAL
Materials Pub Date : 2025-01-30 DOI:10.3390/ma18030627
Paolo Livieri, Michele Bortolan
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引用次数: 0

Abstract

This paper presents a numerical analysis of dimple spot welding (DSW) as an innovative joining technique for dissimilar materials, namely steel and aluminium alloys. Employing a finite element (FE) model, the study simulates the fatigue performance of DSW joints, considering crucial factors such as contact friction and cyclic loading conditions. While various numerical models are proposed, the simulation incorporating friction and fatigue loading appears to offer the highest accuracy. The research highlights that the fatigue behaviour of DSW joints can be effectively investigated through the non-local theory of the implicit gradient approach by utilising the fatigue curve of arc-welded structures composed of steel or aluminium alloys. Specifically, simulations incorporating friction and fatigue loading demonstrate that the steel spot weld does not represent the weakest point within the joints.

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来源期刊
Materials
Materials MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
5.80
自引率
14.70%
发文量
7753
审稿时长
1.2 months
期刊介绍: Materials (ISSN 1996-1944) is an open access journal of related scientific research and technology development. It publishes reviews, regular research papers (articles) and short communications. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. Therefore, there is no restriction on the length of the papers. The full experimental details must be provided so that the results can be reproduced. Materials provides a forum for publishing papers which advance the in-depth understanding of the relationship between the structure, the properties or the functions of all kinds of materials. Chemical syntheses, chemical structures and mechanical, chemical, electronic, magnetic and optical properties and various applications will be considered.
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